Blecon Chip (BCN2201)
Description
The Blecon Chip includes everything required to enable Blecon in your device.
The Blecon modem chip packages up the firmware, radio, antenna and radio approvals in a tiny package with the API serialised over UART, USB or SPI.
System Description
Control Interfaces
Three control interfaces are supported. At least one must be connected to your host MCU for proper operation.
USB
The BCN2201 supports a USB 2.0-compliant full-speed interface. USB pins must be connected to the corresponding USB lines: VUSB, D+ and D-. A virtual serial interface (CDC ACM) is brought up on the host when connected.
SPI
Lines MOSI, MISO and SCK must be connected to the host MCU’s SPI bus. CS is the chip select line. The SPI interface operates in CPOL=0, CPHA=0 mode, and supports up to 32MHz transfer rates.
UART
Lines TX, RX, CTS and RTS must be connected to a UART bus. Hardware (RTS/CTS) flow-control is used for proper operation of the device. The default baudrate is set to 115200bps, with 8 data bits, no parity, and 1 stop bit.
NFC
A NFC antenna can be connected between the differential NFC1 and NFC2 pins. Two external capacitors should be used to tune the resonance of the antenna circuit to 13.56 MHz. The total capacitance on NFC1 and NFC2 must be matched.
When using the reference NFC antenna below, tuning capacitors can be set to 300pF.
Command protocol
For information about the control protocol, please refer to Modem Commands.
Typical Application
Pinout
| Pin Number | Pin Name | Description | Electrical Type |
|---|---|---|---|
1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14 | NC | Do not connect | Unconnected |
15, 21, 39, 45, 52, 54, 56, 59, 61, 62 | GND | Ground | Power input |
16 | VCC | Power supply | Power input |
17 | SWDIO_CTRL | RFU. Do not connect. | Bidirectional |
18 | SWDIO | Blecon internal use. Do not connect. | Bidirectional |
19 | SWCLK_CTRL | RFU. Do not connect. | Output |
20 | SWCLK | Blecon internal use. Do not connect | Input |
22 | CTS | UART Clear to send | Output |
23, 25, 27, 29, 31, 33, 35, 37, 41, 43, 44, 47, 49, 53, 57 | RFU | RFU. Do not connect. | Unconnected |
24 | RTS | UART Ready to send | Input |
26 | TX | UART Transmit | Output |
28 | RX | UART Receive | Input |
30 | INT | SPI Interrupt line | Output |
32 | /CS | SPI Chip Select | Input |
34 | SCK | SPI Serial Clock | Input |
36 | SDO | SPI Serial Data Out | Output |
38 | SDI | SPI Serial Data In | Input |
40 | NFC1 | NFC antenna pin 1 | Bidirectional |
42 | NFC2 | NFC antenna pin 2 | Bidirectional |
46 | D+ | USB D+ | Bidirectional |
48 | D- | USB D- | Bidirectional |
50 | VUSB | USB VBUS input | Power input |
51 | /RESET | Blecon internal use. Do not connect | Input |
55 | SWO | Blecon internal use. Do not connect | Output |
58 | RF | Radio transceiver input/output. Connect to ANT pin for normal use. | Bidirectional |
60 | ANT | Antenna input/output. Connect to RF pin for normal use. | Passive |
LGA QFN 62-pin package. Top view.
Electrical Characteristics
Power consumption
| Symbol | Parameter | Min. | Nom. | Max. | Units |
|---|---|---|---|---|---|
IAVG,B | Average current |
|
| 100 | uA |
Recommended operating conditions
| Symbol | Parameter | Min. | Nom. | Max. | Units |
|---|---|---|---|---|---|
VCC | VCC supply voltage | 1.7 | 3 | 3.6 | V |
VCCPOR | VCC supply voltage needed during power-on reset | 1.75 |
|
| V |
VUSB | VBUS USB supply voltage | 4.35 | 5 | 5.5 | V |
tR_VDD | Supply rise time (0 V to 1.7 V) |
|
| 60 | ms |
tR_VDDH | Supply rise time (0 V to 3.7 V) |
|
| 100 | ms |
TA | Operating temperature | -40 | 25 | 85 | °C |
TAEXT | Extended operating temperature | 85 |
| 105 | °C |
TJ | Junction temperature |
|
| 110 | °C |
Absolute maximum ratings
| Symbol | Min. | Max. | Unit |
|---|---|---|---|
VCC | -0.3 | 3.9 | V |
VUSB | -0.3 | 5.8 | V |
VSS |
| 0 | V |
VI/O, VCC ≤3.6 V | -0.3 | VCC + 0.3 | V |
VI/O, VCC >3.6 V | -0.3 | 3.9 | V |
INFC1/2 |
| 80 | mA |
Mechanical Characteristics
Package dimensions
All units in mm.
Assembly guidelines
We recommend PCB land patterns and solder mask layouts to use the same dimensions as the chip’s pads:
0.4 mm x 0.4 mm for standard pads
0.8 mm x 0.8 mm for standard pads
Keep-out area
For optimal operation, we recommend enforcing a metal-keepout area around the top of the BCN2201, excluding the LGA pads necessary for proper mechanical stability of the chip.
Soldering guidelines
| Parameter | Value |
|---|---|
Temperature Min (Tsmin) | 150 °C |
Temperature Max (Tsmax) | 200 °C |
Time (ts) from (Tsmin to Tsmax) | 60-120 s |
Ramp-up rate (TL to Tp) | 3 °C/s max |
Liquidous temperature (TL) | 217 °C |
Time (tL) maintained above TL | 60 - 150 s |
Peak package body temperature (Tp) | 260 °C (+0/-5 °C) |
Classification Temperature (Tc) | 260 °C |
Time (tp) maintained above TC-5 °C | 30 s |
Ramp-down rate (Tp to TL) | 6 °C/s max |
Time 25 °C to peak temperature | 8 min max |
Markings
| Nomenclature | Example |
|---|---|
BCN2201 PHFYYWW | BCN2201 L112239 |
| Nomenclature | Description |
|---|---|
BCN2201 | Part number |
P | Package Type
|
H | Hardware revision (0-9, A-Z) |
F | Firmware revision (0-9, A-Z) |
YY | Production year number (21-99) |
WW | Production week number (1-53) |
Certification & Qualification
| Certification | Details/Identifier |
|---|---|
FCC | 2AAQS-ISP1907 |
CE | Compliance with 2014/53/EU, EN300328 V2.2.2 – EC DoC TR211204 |
IC | 11306A-ISP1907 |
TELEC | 020-210045 |
KCC | R-C-iNs-ISP1907 |
Bluetooth SIG | D050647 |
Additionally, the BCN2201 chip is RoHS compliant.
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